The 2021 flexible and printed electronics roadmap

Yvan Bonnassieux; Christoph J. Brabec; Yong Cao; Tricia Breen Carmichael; Michael L. Chabinyc; Kwang Ting Cheng; Gyoujin Cho; Anjung Chung; Corie L. Cobb; Andreas Distler; Hans Joachim Egelhaaf; Gerd Grau; Xiaojun Guo; Ghazaleh Haghiashtiani; Tsung Ching Huang; Muhammad M. Hussain; Benjamin Iniguez; Taik Min Lee; Ling Li; Yuguang Ma; Dongge Ma; Michael C. McAlpine; Tse Nga Ng; Ronald Österbacka; Shrayesh N. Patel; Junbiao Peng; Huisheng Peng; Jonathan Rivnay; Leilai Shao; Daniel Steingart; Robert A. Street; Vivek Subramanian; Luisa Torsi; Yunyun Wu

doi:10.1088/2058-8585/abf986

The 2021 flexible and printed electronics roadmap

Yvan Bonnassieux, Christoph J. Brabec, Yong Cao, Tricia Breen Carmichael, Michael L. Chabinyc, Kwang Ting Cheng, Gyoujin Cho, Anjung Chung, Corie L. Cobb, Andreas Distler, Hans Joachim Egelhaaf, Gerd Grau, Xiaojun Guo, Ghazaleh Haghiashtiani, Tsung Ching Huang, Muhammad M. Hussain, Benjamin Iniguez, Taik Min Lee, Ling Li, Yuguang MaDongge Ma, Michael C. McAlpine, Tse Nga Ng, Ronald Österbacka^*, Shrayesh N. Patel, Junbiao Peng, Huisheng Peng, Jonathan Rivnay, Leilai Shao, Daniel Steingart, Robert A. Street, Vivek Subramanian, Luisa Torsi, Yunyun Wu

^*Corresponding author for this work

Research output: Contribution to journal › Review Article or Literature Review › peer-review

152 Citations (Scopus)

Abstract

This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

Original language	English
Article number	023001
Number of pages	48
Journal	Flexible and Printed Electronics
Volume	6
Issue number	2
DOIs	https://doi.org/10.1088/2058-8585/abf986
Publication status	Published - May 2021
MoE publication type	A2 Review article in a scientific journal

Keywords

E-textiles
Flexible and printed electronics
Organic light emitting diodes
Organic photovoltaics
Roll-to-roll printing
Sensors
Thin film transistors

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1088/2058-8585/abf986Licence: CC BY

Cite this

Bonnassieux, Y., Brabec, C. J., Cao, Y., Carmichael, T. B., Chabinyc, M. L., Cheng, K. T., Cho, G., Chung, A., Cobb, C. L., Distler, A., Egelhaaf, H. J., Grau, G., Guo, X., Haghiashtiani, G., Huang, T. C., Hussain, M. M., Iniguez, B., Lee, T. M., Li, L., ... Wu, Y. (2021). The 2021 flexible and printed electronics roadmap. Flexible and Printed Electronics, 6(2), Article 023001. https://doi.org/10.1088/2058-8585/abf986

@article{0c6aea6107154bb4acf0b5e3d6f29f25,

title = "The 2021 flexible and printed electronics roadmap",

abstract = "This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.",

keywords = "E-textiles, Flexible and printed electronics, Organic light emitting diodes, Organic photovoltaics, Roll-to-roll printing, Sensors, Thin film transistors",

author = "Yvan Bonnassieux and Brabec, \{Christoph J.\} and Yong Cao and Carmichael, \{Tricia Breen\} and Chabinyc, \{Michael L.\} and Cheng, \{Kwang Ting\} and Gyoujin Cho and Anjung Chung and Cobb, \{Corie L.\} and Andreas Distler and Egelhaaf, \{Hans Joachim\} and Gerd Grau and Xiaojun Guo and Ghazaleh Haghiashtiani and Huang, \{Tsung Ching\} and Hussain, \{Muhammad M.\} and Benjamin Iniguez and Lee, \{Taik Min\} and Ling Li and Yuguang Ma and Dongge Ma and McAlpine, \{Michael C.\} and Ng, \{Tse Nga\} and Ronald {\"O}sterbacka and Patel, \{Shrayesh N.\} and Junbiao Peng and Huisheng Peng and Jonathan Rivnay and Leilai Shao and Daniel Steingart and Street, \{Robert A.\} and Vivek Subramanian and Luisa Torsi and Yunyun Wu",

note = "Funding Information: Original content from this work may be used under the terms of the . Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Academy of Finland http://dx.doi.org/10.13039/501100002341 316881 316883 Beijing Training Project for the Leading Talents Z15110000031500 National key research and development program 2018YFA0208503 National Institute of Biomedical Imaging and Bioengineering http://dx.doi.org/10.13039/100000070 DP2EB020537 Research Grants Council, Hong Kong HKUST 16203319 Ministry of Science and Technology of China 2016YFA0203302 Ontario Graduate Scholarship Canadian Network for Research and Innovation in Machining Technology, Natural Sciences and Engineering Research Council of Canada http://dx.doi.org/10.13039/501100002790 RGPIN-2018-05525 Air Force Research Laboratory http://dx.doi.org/10.13039/100006602 FA8650-15-2-5401 Strategic Priority Research Program of Chinese Academy of Sciences XDB12030400 XDB30030000 XDB30030300 Defense Advanced Research Projects Agency http://dx.doi.org/10.13039/100000185 D19AP00038 Deutsche Forschungsgemeinschaft http://dx.doi.org/10.13039/501100001659 182849149 – SFB 953 INST 90/1093-1 INST 90/917 National Research Foundation of Korea http://dx.doi.org/10.13039/501100003725 2020R1A5A1019649 National Natural Science Foundation of China http://dx.doi.org/10.13039/501100001809 51521002 61725404 61874134 61890944 Horizon 2020 Framework Programme http://dx.doi.org/10.13039/100010661 824946 NSF DMR 1808622 yes � 2021 The Author(s). Published by IOP Publishing Ltd Creative Commons Attribution 4.0 license Funding Information: This material is based, in part, on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5401, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex. The study was also partially supported by a General Research Fund (GRF) grant from Research Grants Council (RGC), Hong Kong (HKUST 16203319). Publisher Copyright: {\textcopyright} 2021 The Author(s).",

year = "2021",

month = may,

doi = "10.1088/2058-8585/abf986",

language = "English",

volume = "6",

journal = "Flexible and Printed Electronics",

issn = "2058-8585",

publisher = "IOP Publishing",

number = "2",

}

Bonnassieux, Y, Brabec, CJ, Cao, Y, Carmichael, TB, Chabinyc, ML, Cheng, KT, Cho, G, Chung, A, Cobb, CL, Distler, A, Egelhaaf, HJ, Grau, G, Guo, X, Haghiashtiani, G, Huang, TC, Hussain, MM, Iniguez, B, Lee, TM, Li, L, Ma, Y, Ma, D, McAlpine, MC, Ng, TN, Österbacka, R, Patel, SN, Peng, J, Peng, H, Rivnay, J, Shao, L, Steingart, D, Street, RA, Subramanian, V, Torsi, L & Wu, Y 2021, 'The 2021 flexible and printed electronics roadmap', Flexible and Printed Electronics, vol. 6, no. 2, 023001. https://doi.org/10.1088/2058-8585/abf986

TY - JOUR

T1 - The 2021 flexible and printed electronics roadmap

AU - Bonnassieux, Yvan

AU - Brabec, Christoph J.

AU - Cao, Yong

AU - Carmichael, Tricia Breen

AU - Chabinyc, Michael L.

AU - Cheng, Kwang Ting

AU - Cho, Gyoujin

AU - Chung, Anjung

AU - Cobb, Corie L.

AU - Distler, Andreas

AU - Egelhaaf, Hans Joachim

AU - Grau, Gerd

AU - Guo, Xiaojun

AU - Haghiashtiani, Ghazaleh

AU - Huang, Tsung Ching

AU - Hussain, Muhammad M.

AU - Iniguez, Benjamin

AU - Lee, Taik Min

AU - Li, Ling

AU - Ma, Yuguang

AU - Ma, Dongge

AU - McAlpine, Michael C.

AU - Ng, Tse Nga

AU - Österbacka, Ronald

AU - Patel, Shrayesh N.

AU - Peng, Junbiao

AU - Peng, Huisheng

AU - Rivnay, Jonathan

AU - Shao, Leilai

AU - Steingart, Daniel

AU - Street, Robert A.

AU - Subramanian, Vivek

AU - Torsi, Luisa

AU - Wu, Yunyun

N1 - Funding Information: Original content from this work may be used under the terms of the . Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Academy of Finland http://dx.doi.org/10.13039/501100002341 316881 316883 Beijing Training Project for the Leading Talents Z15110000031500 National key research and development program 2018YFA0208503 National Institute of Biomedical Imaging and Bioengineering http://dx.doi.org/10.13039/100000070 DP2EB020537 Research Grants Council, Hong Kong HKUST 16203319 Ministry of Science and Technology of China 2016YFA0203302 Ontario Graduate Scholarship Canadian Network for Research and Innovation in Machining Technology, Natural Sciences and Engineering Research Council of Canada http://dx.doi.org/10.13039/501100002790 RGPIN-2018-05525 Air Force Research Laboratory http://dx.doi.org/10.13039/100006602 FA8650-15-2-5401 Strategic Priority Research Program of Chinese Academy of Sciences XDB12030400 XDB30030000 XDB30030300 Defense Advanced Research Projects Agency http://dx.doi.org/10.13039/100000185 D19AP00038 Deutsche Forschungsgemeinschaft http://dx.doi.org/10.13039/501100001659 182849149 – SFB 953 INST 90/1093-1 INST 90/917 National Research Foundation of Korea http://dx.doi.org/10.13039/501100003725 2020R1A5A1019649 National Natural Science Foundation of China http://dx.doi.org/10.13039/501100001809 51521002 61725404 61874134 61890944 Horizon 2020 Framework Programme http://dx.doi.org/10.13039/100010661 824946 NSF DMR 1808622 yes � 2021 The Author(s). Published by IOP Publishing Ltd Creative Commons Attribution 4.0 license Funding Information: This material is based, in part, on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5401, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex. The study was also partially supported by a General Research Fund (GRF) grant from Research Grants Council (RGC), Hong Kong (HKUST 16203319). Publisher Copyright: © 2021 The Author(s).

PY - 2021/5

Y1 - 2021/5

N2 - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

AB - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

KW - E-textiles

KW - Flexible and printed electronics

KW - Organic light emitting diodes

KW - Organic photovoltaics

KW - Roll-to-roll printing

KW - Sensors

KW - Thin film transistors

UR - http://www.scopus.com/inward/record.url?scp=85107977151&partnerID=8YFLogxK

U2 - 10.1088/2058-8585/abf986

DO - 10.1088/2058-8585/abf986

M3 - Review Article or Literature Review

AN - SCOPUS:85107977151

SN - 2058-8585

VL - 6

JO - Flexible and Printed Electronics

JF - Flexible and Printed Electronics

IS - 2

M1 - 023001

ER -

The 2021 flexible and printed electronics roadmap

Abstract

Keywords

UN SDGs

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BACE: Center of Excellence in Bioelectronic Activation of Cell Functions

SIMBIT: Single molecule bio-electronic smart system array for clinical testing

SPACE: Spatiotemporal Control of Cell Functions

Flexible and Printed Electronics (Journal)

Cite this

The 2021 flexible and printed electronics roadmap

Abstract

Keywords

UN SDGs

Access to Document

Other files and links

Fingerprint

Projects

BACE: Center of Excellence in Bioelectronic Activation of Cell Functions

SIMBIT: Single molecule bio-electronic smart system array for clinical testing

SPACE: Spatiotemporal Control of Cell Functions

Activities

Flexible and Printed Electronics (Journal)

Cite this