TY - JOUR
T1 - The 2021 flexible and printed electronics roadmap
AU - Bonnassieux, Yvan
AU - Brabec, Christoph J.
AU - Cao, Yong
AU - Carmichael, Tricia Breen
AU - Chabinyc, Michael L.
AU - Cheng, Kwang Ting
AU - Cho, Gyoujin
AU - Chung, Anjung
AU - Cobb, Corie L.
AU - Distler, Andreas
AU - Egelhaaf, Hans Joachim
AU - Grau, Gerd
AU - Guo, Xiaojun
AU - Haghiashtiani, Ghazaleh
AU - Huang, Tsung Ching
AU - Hussain, Muhammad M.
AU - Iniguez, Benjamin
AU - Lee, Taik Min
AU - Li, Ling
AU - Ma, Yuguang
AU - Ma, Dongge
AU - McAlpine, Michael C.
AU - Ng, Tse Nga
AU - Österbacka, Ronald
AU - Patel, Shrayesh N.
AU - Peng, Junbiao
AU - Peng, Huisheng
AU - Rivnay, Jonathan
AU - Shao, Leilai
AU - Steingart, Daniel
AU - Street, Robert A.
AU - Subramanian, Vivek
AU - Torsi, Luisa
AU - Wu, Yunyun
N1 - Funding Information:
Original content from this work may be used under the terms of the . Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI. Academy of Finland http://dx.doi.org/10.13039/501100002341 316881 316883 Beijing Training Project for the Leading Talents Z15110000031500 National key research and development program 2018YFA0208503 National Institute of Biomedical Imaging and Bioengineering http://dx.doi.org/10.13039/100000070 DP2EB020537 Research Grants Council, Hong Kong HKUST 16203319 Ministry of Science and Technology of China 2016YFA0203302 Ontario Graduate Scholarship Canadian Network for Research and Innovation in Machining Technology, Natural Sciences and Engineering Research Council of Canada http://dx.doi.org/10.13039/501100002790 RGPIN-2018-05525 Air Force Research Laboratory http://dx.doi.org/10.13039/100006602 FA8650-15-2-5401 Strategic Priority Research Program of Chinese Academy of Sciences XDB12030400 XDB30030000 XDB30030300 Defense Advanced Research Projects Agency http://dx.doi.org/10.13039/100000185 D19AP00038 Deutsche Forschungsgemeinschaft http://dx.doi.org/10.13039/501100001659 182849149 – SFB 953 INST 90/1093-1 INST 90/917 National Research Foundation of Korea http://dx.doi.org/10.13039/501100003725 2020R1A5A1019649 National Natural Science Foundation of China http://dx.doi.org/10.13039/501100001809 51521002 61725404 61874134 61890944 Horizon 2020 Framework Programme http://dx.doi.org/10.13039/100010661 824946 NSF DMR 1808622 yes � 2021 The Author(s). Published by IOP Publishing Ltd Creative Commons Attribution 4.0 license
Funding Information:
This material is based, in part, on research sponsored by Air Force Research Laboratory under agreement number FA8650-15-2-5401, as conducted through the flexible hybrid electronics manufacturing innovation institute, NextFlex. The study was also partially supported by a General Research Fund (GRF) grant from Research Grants Council (RGC), Hong Kong (HKUST 16203319).
Publisher Copyright:
© 2021 The Author(s).
PY - 2021/5
Y1 - 2021/5
N2 - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
AB - This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.
KW - E-textiles
KW - Flexible and printed electronics
KW - Organic light emitting diodes
KW - Organic photovoltaics
KW - Roll-to-roll printing
KW - Sensors
KW - Thin film transistors
UR - http://www.scopus.com/inward/record.url?scp=85107977151&partnerID=8YFLogxK
U2 - 10.1088/2058-8585/abf986
DO - 10.1088/2058-8585/abf986
M3 - Review Article or Literature Review
AN - SCOPUS:85107977151
SN - 2058-8585
VL - 6
JO - Flexible and Printed Electronics
JF - Flexible and Printed Electronics
IS - 2
M1 - 023001
ER -
