Sarcina, L.,
Scandurra, C.,
Caputo, M.,
Catacchio, M.,
Di Franco, C.,
Bollella, P.,
Chironna, M.,
Torricelli, F.,
Esposito, I.,
Osterbacka, R.,
Scamarcio, G.,
Macchia, E. &
Torsi, L.,
2023,
FLEPS 2023 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings. the Institute of Electrical and Electronics Engineers, Inc.,
7 p. (IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), proceedings).
Research output: Chapter in Book/Conference proceeding › Conference contribution › Scientific › peer-review