Sammanfattning
The CDIO Initiative is going through a process of reconsidering and updating the CDIO approach for engineering education development. Previous work resulted in substantial updates of the twelve CDIO standards and the introduction of "optional" CDIO standards. This paper reports on a similar review and update of the CDIO Syllabus to version 3.0. It has been developed by a working group consisting of four sub-groups and iterated and refined guided by feedback from the whole CDIO community. There are mainly three external drivers that motivate the changes: sustainability, digitalization, and acceleration. There is also an internal driver in the form of lessons learned within the CDIO community, from using the Syllabus in curriculum and course development. Approximately 70 updates are proposed, amongst them three additions on the X.X level, namely 1.4 Knowledge of Social Sciences and Humanities, 3.1 Teamwork and Collaboration, and 5.3 Research.
| Originalspråk | Engelska |
|---|---|
| Titel på värdpublikation | 18th CDIO International Conference, CDIO 2022 - Proceedings |
| Redaktörer | Maria Sigridur Gudjonsdottir, Haraldur Audunsson, Arkaitz Manterola Donoso, Gudmundur Kristjansson, Ingunn Saemundsdottir, Joseph Timothy Foley, Marcel Kyas, Angkee Sripakagorn, Janne Roslof, Jens Bennedsen, Kristina Edstrom, Natha Kuptasthien, Reidar Lyng |
| Förlag | Chalmers University of Technology |
| Sidor | 18-36 |
| Antal sidor | 19 |
| ISBN (elektroniskt) | 9789935965561 |
| Status | Publicerad - 2022 |
| Externt publicerad | Ja |
| MoE-publikationstyp | A4 Artikel i en konferenspublikation |
| Evenemang | 18th International CDIO Conference, CDIO 2022 - Reykjavik, Island Varaktighet: 13 juni 2022 → 15 juni 2022 |
Publikationsserier
| Namn | Proceedings of the International CDIO Conference |
|---|---|
| ISSN (elektroniskt) | 2002-1593 |
Konferens
| Konferens | 18th International CDIO Conference, CDIO 2022 |
|---|---|
| Land/Territorium | Island |
| Ort | Reykjavik |
| Period | 13/06/22 → 15/06/22 |
Finansiering
The authors received no financial support for this work.
Fingeravtryck
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