Round Robin test on bio-imaging transfer standard for 3D optical profilers

A. Nolvi, T. Viitala, A. García Pérez, N. Sandler, E. Hæggström, C. Bermudez, R. Artigas, I. Kassamakov

Forskningsoutput: Kapitel i bok/konferenshandlingKonferensbidragVetenskapligPeer review

1 Citeringar (Scopus)

Sammanfattning

A stair case height Bio-Transfer-Standard (BTS), developed and produced at the University of Helsinki (UH), was measured in two laboratories. The Round Robin test aims to determine whether BTS works with different optical profilers in different laboratories. First the artefact was measured at UH using a custom-built Scanning White Light Interferometer. Then BTS was measured at Sensofar-Tech, S.L. using an S-neox-type interferometer working either in Phase Shifting Interferometry mode or in Imaging Confocal Microscopy mode. To remove the influence of system calibration, a method featuring sample shifting and measurement subtraction was used. The BTS features eight lipid bilayer steps that each are 4.6 ± 0.1 nm tall on average. All 30 measurements done by four different operators at the two laboratories agree to within 0.1 nm which agrees with theoretical estimates and with measurements done using a surface plasmon resonance technique. The Round Robin results show the applicability of the newly developed bio-imaging transfer standard for calibrating 3D optical profilers.

OriginalspråkEngelska
Titel på värdpublikationPhotonic Instrumentation Engineering IV
RedaktörerYakov G. Soskind, Craig Olson
FörlagSPIE, The International Society for Optical Engineering
ISBN (elektroniskt)9781510606616
ISBN (tryckt)9781510606616
DOI
StatusPublicerad - 2017
MoE-publikationstypA4 Artikel i en konferenspublikation
EvenemangPhotonic Instrumentation Engineering IV - San Francisco, California, USA
Varaktighet: 28 jan. 20172 feb. 2017

Publikationsserier

NamnProceedings of SPIE - The International Society for Optical Engineering
Volym10110
ISSN (tryckt)0277-786X
ISSN (elektroniskt)1996-756X

Konferens

KonferensPhotonic Instrumentation Engineering IV
Land/TerritoriumUSA
OrtSan Francisco, California
Period28/01/1702/02/17

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