Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

Desmond Attah-Kyei; Guven Akdogan; Daniel Lindberg; Christie Dorfling

doi:10.1007/978-3-030-36556-1_12

Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

Desmond Attah-Kyei, Guven Akdogan, Daniel Lindberg, Christie Dorfling

Forskningsoutput: Kapitel i bok/konferenshandling › Kapitel › Vetenskaplig › Peer review

Originalspråk	Engelska
Titel på värdpublikation	Materials Processing Fundamentals 2020
Redaktörer	Jonghyun Lee, Samuel Wagstaff, Guillaume Lambotte, Antoine Allanore, Fiseha Tesfaye
Förlag	Springer
Sidor	129-139
ISBN (elektroniskt)	978-3-030-36556-1
ISBN (tryckt)	978-3-030-36555-4
DOI	https://doi.org/10.1007/978-3-030-36556-1_12
Status	Publicerad - 2020
MoE-publikationstyp	A3 Del av bok eller annan forskningsbok

Publikationsserier

Namn	Minerals, Metals and Materials Series
Förlag	Springer
ISSN (tryckt)	2367-1181
ISSN (elektroniskt)	2367-1696

Åtkomst av dokument

10.1007/978-3-030-36556-1_12Licens: Ospecificerad

Citera det här

Attah-Kyei, D., Akdogan, G., Lindberg, D., & Dorfling, C. (2020). Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. I J. Lee, S. Wagstaff, G. Lambotte, A. Allanore, & F. Tesfaye (Red.), Materials Processing Fundamentals 2020 (s. 129-139). (Minerals, Metals and Materials Series). Springer. https://doi.org/10.1007/978-3-030-36556-1_12

Attah-Kyei, Desmond ; Akdogan, Guven ; Lindberg, Daniel et al. / Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. Materials Processing Fundamentals 2020. redaktör / Jonghyun Lee ; Samuel Wagstaff ; Guillaume Lambotte ; Antoine Allanore ; Fiseha Tesfaye. Springer, 2020. s. 129-139 (Minerals, Metals and Materials Series).

@inbook{ced5bfbe62aa4e04886170643092eb1c,

title = "Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes",

author = "Desmond Attah-Kyei and Guven Akdogan and Daniel Lindberg and Christie Dorfling",

year = "2020",

doi = "10.1007/978-3-030-36556-1_12",

language = "English",

isbn = "978-3-030-36555-4",

series = "Minerals, Metals and Materials Series",

publisher = "Springer",

pages = "129--139",

editor = "Lee, {Jonghyun } and Samuel Wagstaff and Lambotte, {Guillaume } and Allanore, {Antoine } and Tesfaye, {Fiseha }",

booktitle = "Materials Processing Fundamentals 2020",

}

Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. / Attah-Kyei, Desmond; Akdogan, Guven; Lindberg, Daniel et al.
Materials Processing Fundamentals 2020. red. / Jonghyun Lee; Samuel Wagstaff; Guillaume Lambotte; Antoine Allanore; Fiseha Tesfaye. Springer, 2020. s. 129-139 (Minerals, Metals and Materials Series).

Forskningsoutput: Kapitel i bok/konferenshandling › Kapitel › Vetenskaplig › Peer review

TY - CHAP

T1 - Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

AU - Attah-Kyei, Desmond

AU - Akdogan, Guven

AU - Lindberg, Daniel

AU - Dorfling, Christie

PY - 2020

Y1 - 2020

U2 - 10.1007/978-3-030-36556-1_12

DO - 10.1007/978-3-030-36556-1_12

M3 - Chapter

SN - 978-3-030-36555-4

T3 - Minerals, Metals and Materials Series

SP - 129

EP - 139

BT - Materials Processing Fundamentals 2020

A2 - Lee, Jonghyun

A2 - Wagstaff, Samuel

A2 - Lambotte, Guillaume

A2 - Allanore, Antoine

A2 - Tesfaye, Fiseha

PB - Springer

ER -