Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

Desmond Attah-Kyei; Guven Akdogan; Daniel Lindberg; Christie Dorfling

doi:10.1007/978-3-030-36556-1_12

Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

Desmond Attah-Kyei, Guven Akdogan, Daniel Lindberg, Christie Dorfling

Tutkimustuotos: Artikkeli kirjassa/raportissa/konferenssijulkaisussa › Luku › Tieteellinen › vertaisarvioitu

Alkuperäiskieli	Englanti
Otsikko	Materials Processing Fundamentals 2020
Toimittajat	Jonghyun Lee, Samuel Wagstaff, Guillaume Lambotte, Antoine Allanore, Fiseha Tesfaye
Kustantaja	Springer
Sivut	129-139
ISBN (elektroninen)	978-3-030-36556-1
ISBN (painettu)	978-3-030-36555-4
DOI - pysyväislinkit	https://doi.org/10.1007/978-3-030-36556-1_12
Tila	Julkaistu - 2020
OKM-julkaisutyyppi	A3 Kirjan osa tai toinen tutkimuskirja

Julkaisusarja

Nimi	Minerals, Metals and Materials Series
Kustantaja	Springer
ISSN (painettu)	2367-1181
ISSN (elektroninen)	2367-1696

Pääsy asiakirjaan

10.1007/978-3-030-36556-1_12Lisenssi: Määrittelemätön

Viittausmuodot

Attah-Kyei, D., Akdogan, G., Lindberg, D., & Dorfling, C. (2020). Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. teoksessa J. Lee, S. Wagstaff, G. Lambotte, A. Allanore, & F. Tesfaye (Toimittajat), Materials Processing Fundamentals 2020 (Sivut 129-139). (Minerals, Metals and Materials Series). Springer. https://doi.org/10.1007/978-3-030-36556-1_12

Attah-Kyei, Desmond ; Akdogan, Guven ; Lindberg, Daniel et al. / Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. Materials Processing Fundamentals 2020. Toimittaja / Jonghyun Lee ; Samuel Wagstaff ; Guillaume Lambotte ; Antoine Allanore ; Fiseha Tesfaye. Springer, 2020. Sivut 129-139 (Minerals, Metals and Materials Series).

@inbook{ced5bfbe62aa4e04886170643092eb1c,

title = "Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes",

author = "Desmond Attah-Kyei and Guven Akdogan and Daniel Lindberg and Christie Dorfling",

year = "2020",

doi = "10.1007/978-3-030-36556-1_12",

language = "English",

isbn = "978-3-030-36555-4",

series = "Minerals, Metals and Materials Series",

publisher = "Springer",

pages = "129--139",

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Attah-Kyei, D, Akdogan, G, Lindberg, D & Dorfling, C 2020, Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. julkaisussa J Lee, S Wagstaff, G Lambotte, A Allanore & F Tesfaye (toim), Materials Processing Fundamentals 2020. Minerals, Metals and Materials Series, Springer, Sivut 129-139. https://doi.org/10.1007/978-3-030-36556-1_12

Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. / Attah-Kyei, Desmond; Akdogan, Guven; Lindberg, Daniel et al.
Materials Processing Fundamentals 2020. toim. / Jonghyun Lee; Samuel Wagstaff; Guillaume Lambotte; Antoine Allanore; Fiseha Tesfaye. Springer, 2020. s. 129-139 (Minerals, Metals and Materials Series).

Tutkimustuotos: Artikkeli kirjassa/raportissa/konferenssijulkaisussa › Luku › Tieteellinen › vertaisarvioitu

TY - CHAP

T1 - Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

AU - Attah-Kyei, Desmond

AU - Akdogan, Guven

AU - Lindberg, Daniel

AU - Dorfling, Christie

PY - 2020

Y1 - 2020

U2 - 10.1007/978-3-030-36556-1_12

DO - 10.1007/978-3-030-36556-1_12

M3 - Chapter

SN - 978-3-030-36555-4

T3 - Minerals, Metals and Materials Series

SP - 129

EP - 139

BT - Materials Processing Fundamentals 2020

A2 - Lee, Jonghyun

A2 - Wagstaff, Samuel

A2 - Lambotte, Guillaume

A2 - Allanore, Antoine

A2 - Tesfaye, Fiseha

PB - Springer

ER -

Attah-Kyei D, Akdogan G, Lindberg D, Dorfling C. Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. julkaisussa Lee J, Wagstaff S, Lambotte G, Allanore A, Tesfaye F, toimittajat, Materials Processing Fundamentals 2020. Springer. 2020. s. 129-139. (Minerals, Metals and Materials Series). doi: 10.1007/978-3-030-36556-1_12