Thermal modelling of 3D multicore systems in a flip-chip package

Kameswar Rao Vaddina, Tamoghna Mitra, Pasi Liljeberg, Juha Plosila

    Research output: Chapter in Book/Conference proceedingConference contributionScientificpeer-review

    4 Citations (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationSOC Conference (SOCC), 2010 IEEE International
    EditorsThomas Büchner
    PublisherIEEE
    Pages379–383
    ISBN (Print)978-1-4244-6682-5
    DOIs
    Publication statusPublished - 2010
    MoE publication typeA4 Article in a conference publication
    EventIEEE International SOC Conference - Las Vegas, NV
    Duration: 27 Sep 201029 Sep 2010

    Conference

    ConferenceIEEE International SOC Conference
    Period27/09/1029/09/10

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