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Abstract
Shellfish waste with non-metallic fractions from waste printed circuit boards (D-NMFs and W-NMFs) were used to reinforce polypropylene (PP). Thermal stability and mechanical properties were investigated, supplemented by finite element analysis, to investigate the reinforcement mechanism. Thermal property studies revealed a significant strengthening of the PP matrix upon NMFs incorporation. Final decomposition temperature increased from 391ºC for pure PP to 415ºC and 420ºC with 15 wt.% NMFs, and further reached ~ 435ºC and ~ 430ºC with clam and crab shell. Regarding mechanical properties, NMFs inclusion, especially W-NMFs, significantly elevated the composites’ stiffness. Tensile modulus, along with flexural strength and flexural modulus increased from 917.31 MPa, 33.02 MPa, and 509.24 MPa for pure PP to 1368.82 MPa, 54.95 MPa, and 1678.12 MPa, respectively, for composites with 15 wt.% W-NMFs. NMFs/PP composites filled with shells, especially clam shells, could further improve the filling effect. The tensile modulus, along with flexural strength, increased from 1379.04 MPa, 52.97 MPa, and 1103.49 MPa to 1579.05 MPa, 54.72 MPa, and 1918.96 MPa, respectively, for composites containing 10 wt.% W-NMFs and 15 wt.% clam shell.
Original language | English |
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Pages (from-to) | 4223-4234 |
Number of pages | 28 |
Journal | JOM Journal of the Minerals, Metals and Materials Society |
Volume | 76 |
Issue number | 8 |
Early online date | 9 May 2024 |
DOIs | |
Publication status | Published - 9 May 2024 |
MoE publication type | A1 Journal article-refereed |
Keywords
- Polymer composite
- hybrid fillers
- waste printed circuit board
- shellfish waste
- Circular economy
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Dive into the research topics of 'Thermal, Mechanical Properties and Finite Element Analysis of Polypropylene Hybrid Composites from Nonmetallic Fractions of Waste Printed Circuit Boards (WPCBs) and Shellfish Waste'. Together they form a unique fingerprint.Projects
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GLCE: A step forward on greener and low-carbon extraction and recovery of non-ferrous metals
Tesfaye, F. (Principal Investigator), Vainio, E. (Principal Investigator) & Hupa, L. (Principal Investigator)
01/01/24 → 31/12/25
Project: Foundation