Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

Desmond Attah-Kyei; Guven Akdogan; Daniel Lindberg; Christie Dorfling

doi:10.1007/978-3-030-36556-1_12

Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

Desmond Attah-Kyei, Guven Akdogan, Daniel Lindberg, Christie Dorfling

Research output: Chapter in Book/Conference proceeding › Chapter › Scientific › peer-review

Original language	English
Title of host publication	Materials Processing Fundamentals 2020
Editors	Jonghyun Lee, Samuel Wagstaff, Guillaume Lambotte, Antoine Allanore, Fiseha Tesfaye
Publisher	Springer
Pages	129-139
ISBN (Electronic)	978-3-030-36556-1
ISBN (Print)	978-3-030-36555-4
DOIs	https://doi.org/10.1007/978-3-030-36556-1_12
Publication status	Published - 2020
MoE publication type	A3 Part of a book or another research book

Publication series

Name	Minerals, Metals and Materials Series
Publisher	Springer
ISSN (Print)	2367-1181
ISSN (Electronic)	2367-1696

Access to Document

10.1007/978-3-030-36556-1_12Licence: Unknown

Cite this

Attah-Kyei, D., Akdogan, G., Lindberg, D., & Dorfling, C. (2020). Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. In J. Lee, S. Wagstaff, G. Lambotte, A. Allanore, & F. Tesfaye (Eds.), Materials Processing Fundamentals 2020 (pp. 129-139). (Minerals, Metals and Materials Series). Springer. https://doi.org/10.1007/978-3-030-36556-1_12

Attah-Kyei, Desmond ; Akdogan, Guven ; Lindberg, Daniel et al. / Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. Materials Processing Fundamentals 2020. editor / Jonghyun Lee ; Samuel Wagstaff ; Guillaume Lambotte ; Antoine Allanore ; Fiseha Tesfaye. Springer, 2020. pp. 129-139 (Minerals, Metals and Materials Series).

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Attah-Kyei, D, Akdogan, G, Lindberg, D & Dorfling, C 2020, Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. in J Lee, S Wagstaff, G Lambotte, A Allanore & F Tesfaye (eds), Materials Processing Fundamentals 2020. Minerals, Metals and Materials Series, Springer, pp. 129-139. https://doi.org/10.1007/978-3-030-36556-1_12

Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes. / Attah-Kyei, Desmond; Akdogan, Guven; Lindberg, Daniel et al.
Materials Processing Fundamentals 2020. ed. / Jonghyun Lee; Samuel Wagstaff; Guillaume Lambotte; Antoine Allanore; Fiseha Tesfaye. Springer, 2020. p. 129-139 (Minerals, Metals and Materials Series).

Research output: Chapter in Book/Conference proceeding › Chapter › Scientific › peer-review

TY - CHAP

T1 - Printed Circuit Board Leached Residue as a Substitute Reducing Agent in Pyrometallurgical Processes

AU - Attah-Kyei, Desmond

AU - Akdogan, Guven

AU - Lindberg, Daniel

AU - Dorfling, Christie

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SP - 129

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BT - Materials Processing Fundamentals 2020

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A2 - Wagstaff, Samuel

A2 - Lambotte, Guillaume

A2 - Allanore, Antoine

A2 - Tesfaye, Fiseha

PB - Springer

ER -