Evaluation of printed electronics manufacturing line with sensor platform application

Eerik Halonen*, Kimmo Kaija, Matti Mäntysalo, Antti Kemppainen, Ronald Österbacka, Niklas Björklund

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedingConference contributionScientificpeer-review

8 Citations (Scopus)
Original languageEnglish
Title of host publication2009 European Microelectronics and Packaging Conference, EMPC 2009
Publication statusPublished - 2009
MoE publication typeA4 Article in a conference publication
Event2009 European Microelectronics and Packaging Conference, EMPC 2009 - Rimini, Italy
Duration: 15 Jun 200918 Jun 2009

Publication series

Name2009 European Microelectronics and Packaging Conference, EMPC 2009

Conference

Conference2009 European Microelectronics and Packaging Conference, EMPC 2009
CountryItaly
CityRimini
Period15/06/0918/06/09

Keywords

  • Electrical interconnection
  • Electronics manufacturing
  • Printed electronics
  • Technology integration

Fingerprint Dive into the research topics of 'Evaluation of printed electronics manufacturing line with sensor platform application'. Together they form a unique fingerprint.

Cite this