Thermal modelling of 3D multicore systems in a flip-chip package

A4 Konferenspublikationer

Interna författare/redaktörer

Publikationens författare: Kameswar Rao Vaddina, Tamoghna Mitra, Pasi Liljeberg, Juha Plosila
Redaktörer: Thomas Büchner
Förlagsort: Piscataway, NJ
Publiceringsår: 2010
Förläggare: IEEE
Moderpublikationens namn: SOC Conference (SOCC), 2010 IEEE International
Artikelns första sida, sidnummer: 379
Artikelns sista sida, sidnummer: 383
ISBN: 978-1-4244-6682-5


Three-dimensional (3D) technology offers greater device integration, reduced signal delay and reduced interconnect power. It also provides greater design flexibility by allowing heterogeneous integration. In this work, a 3D thermal model of a multicore system is developed to investigate the effects of hotspot, and placement of silicon die layers, on the thermal performance of a modern flip-chip package. In this regard, both the steady-state and transient heat transfer analysis has been performed on the 3D flip-chip package. Two different thermal models were evaluated under different operating conditions. Through experimental simulations, we have found a model which has better thermal performance. The optimal placement solution is also provided based on the maximum temperature attained by the individual silicon dies. We have also provided the improvement that is required in the heat sink thermal resistance of a 3D system when compared to the single-die system.

Senast uppdaterad 2020-18-02 vid 05:23